During its Summit conference, MediaTek, the Taiwan-based chipmaker, announced its latest 5G chipset called the Dimensity 9000 5G. It is the world’s first TSMC chip based on the 4nm process and made to compete with high-end flagship chipsets that include the upcoming Snapdragon 898, Exynos 2200, and Apple’s chipsets. And not only that, but it also has the world’s first Bluetooth 5.3 on board. In addition, it also has the world’s first 3CC carrier aggregation. Wait, let me add; it also has the world’s first simultaneous triple camera 18-bit video recording. So how many times did you read the “world’s first” so far? Hold on; there are even more. Let’s talk.
The World’s First 4nm Chip – Details
MediaTek Dimensity 9000 is arranged in a 1+3+4 setup. It uses an Arm Cortex X2 Ultra-core that clocks up to 3.05GHz, making it the world’s first chip to use one. It also includes 3 Cortex -A710 Super cores clocked at up to 2.85GHz and 4 Cortex-A510 Efficiency cores. It is the world’s first chip to use an Arm Mali-G710 graphics processor. It is the world’s first to have ray-tracing SDK for Android using Vulkan.
The chipset will support LPDDR5x RAM speeds of up to 7500Mbps in smartphones. It also has 14MB of cache, which Mediatek says improves performance by 7% and bandwidth consumption by 25% versus just 8MB of cache. It gets support for a 5th generation AI processing unit (APU).
MediaTek Dimensity 9000 5G – More world’s firsts
It is the world’s first chipset to support a 320MP camera on a smartphone. MediaTek Dimensity 9000 is also the world’s first and only 5G smartphone modem to support R16 UL Tx Switching for both SUL and NR UL-CA based connections. It brings improved power consumption for both active and standby 5G connections.
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